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CVE PROGRAM SOURCE RECORDUnscored

CVE-2017-18157

A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212

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Status
Published
Published
Updated
Assigning organization
qualcomm

Description

A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.

Affected products

Version statuses are supplied by the assigning organization. Consult the original record for detailed ranges and platform conditions.

Qualcomm Technologies, Inc. Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear

  • MDM9206affected
  • MDM9607affected
  • MDM9650affected
  • MSM8909Waffected
  • MSM8996AUaffected
  • SD 210/SD 212/SD 205affected
  • SD 425affected
  • SD 450affected
  • SD 615/16/SD 415affected
  • SD 625affected
  • SD 650/52affected
  • SD 820affected
  • SD 820Aaffected
  • SD 835affected
  • SD 845affected
  • SDX20affected

References