{"id":"CVE-2019-2275","state":"PUBLISHED","title":"While deserializing any key blob during key operations, buffer overflow could occur exposing partial key information if any key operations are invoked(Depends on CVE-2018-13907) in","description":"While deserializing any key blob during key operations, buffer overflow could occur exposing partial key information if any key operations are invoked(Depends on CVE-2018-13907) in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in MDM9150, MDM9205, MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, QCS404, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130","publishedAt":"2019-11-06T17:11:25.000Z","updatedAt":"2024-08-04T18:42:51.125Z","severity":null,"assigner":"qualcomm","products":["Qualcomm, Inc. Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking"],"affected":[{"vendor":"Qualcomm, Inc.","product":"Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking","versions":[{"version":"MDM9150, MDM9205, MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, QCS404, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130","status":"affected"}]}],"references":["https://www.qualcomm.com/company/product-security/bulletins"],"weaknesses":[],"ingestedAt":"2026-10-29T19:45:56.293Z","source":{"repository":"CVEProject/cvelistV5","path":"cves/2019/2xxx/CVE-2019-2275.json","commit":"556c9d3a8cd17e218bb8e452ba7cd619a384ff47"},"raw":{"dataType":"CVE_RECORD","dataVersion":"5.1","cveMetadata":{"cveId":"CVE-2019-2275","state":"PUBLISHED","datePublished":"2019-11-06T17:11:25.000Z","dateUpdated":"2024-08-04T18:42:51.125Z","assignerShortName":"qualcomm","assignerOrgId":"2cfc7d3e-20d3-47ac-8db7-1b7285aff15f","dateReserved":"2018-12-10T00:00:00.000Z"},"containers":{"cna":{"descriptions":[{"lang":"en","value":"While deserializing any key blob during key operations, buffer overflow could occur exposing partial key information if any key operations are invoked(Depends on CVE-2018-13907) in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics 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